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"Fast RAM" can be increased by fitting DIP (up to 4 MB) or ZIP DRAM chips (up to 16 MB) available in two varieties, Page Mode or Static Column.
It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon via's (TSV)'s in advanced 3D wafer level packaging technology .
XDR DRAM, or extreme data rate dynamic random-access memory