It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon via's (TSV)'s in advanced 3D wafer level packaging technology .
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Advanced Silicon Etch (ASE) is a deep reactive ion etching (DRIE) technique to rapidly etch deep and high aspect ratio structures in silicon.